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O-rings may appear simple, but in the electronics and semiconductor industry they are absolutely critical components. They provide airtight and gastight seals in vacuum chambers, cleanrooms, gas lines, and critical instruments. An incorrect material choice or improper handling can result in contamination, production loss, or even hazardous gas leaks, potentially causing millions of euros in damage to, for example, a wafer fabrication line. That is why stricter requirements apply here than in almost any other industry: minimal particle emission, low outgassing, chemical resistance, and absolute reliability.
O-rings play a role in virtually every step of semiconductor manufacturing. In vacuum chambers and load locks, they ensure airtight seals that withstand bake-outs, vacuum, and severe temperature fluctuations without releasing gas. In process chambers, such as CVD, PVD, or etching, they are indispensable: seals must withstand extreme conditions ranging from high temperatures and plasmas to aggressive process gases.
In gas lines and valves, O-rings are expected to safely contain toxic and reactive gases such as NF₃, Cl₂, or WF₆. In wet processes and so-called wet benches, the exceptional chemical resistance of materials such as PTFE and FFKM is crucial.
O-rings are also used in pumps and mechanical seals, where they must prove reliable under high pressure and dynamic load, as well as in testing and measuring equipment, where they need to withstand repeated temperature cycles or cryogenic conditions. What all these applications have in common is that even the smallest leak or trace contamination can lead to defective chips, lower yields, and ultimately skyrocketing costs.
The right sealing solution not only improves process reliability but also prevents costly downtime. In the semiconductor industry, this means O-rings directly affect yield and throughput. High-performance O-rings minimize outgassing, reduce particle formation, and maintain a stable vacuum. This keeps wafers clean, ensures predictable process quality, and significantly lowers defect rates. The result is higher production efficiency and lower manufacturing costs, two crucial factors in a sector where every minute of downtime can cost millions.
Beyond process optimization, safety plays an equally important role. Leaks of toxic or reactive gases such as Cl₂, NF₃, or SiH₄ can damage equipment and pose serious risks to personnel. Reliable sealing minimizes these hazards and makes it possible to work with high pressures and aggressive substances without compromising safety. High-purity materials such as FFKM or PTFE are specifically designed to minimize contamination while withstanding the most demanding process conditions.
By choosing O-rings that meet the strict requirements of the electronics and semiconductor industry, companies gain a double benefit: maximum process efficiency and a safe working environment. This makes material selection not just a technical issue, but also an investment in long-term reliability, continuity, and safety.
The choice of material determines the success of the seal. Where standard elastomers fall short, high-purity compounds are used:
FFKM O-rings : the benchmark for critical processes; resistant to nearly all chemicals, high temperatures (>300 °C), and plasma. Minimal outgassing and particle emission, but at the highest cost.
FKM O-rings : suitable for less aggressive environments up to ~200–250 °C; more economical than FFKM but with more limited chemical resistance.
PTFE O-rings : extremely chemically resistant and nearly gas-tight; often used in wet chemistry.
Aflas® (FEMP) O-rings : a specialty material resistant to fluorinated gases and amines.
EPDM, silicone, and NBR O-rings : typically used only in peripheral equipment or less critical components.
In addition to material, factors such as surface quality, compression set, and production method (cleanroom grade, low-outgassing, traceable packaging) play a decisive role.
